MULTICHIP MODULE PACKAGE

PROBLEM TO BE SOLVED: To dispense with a wire-bonding interconnection and moreover, to reduce the thickness of a package by a method, wherein a metal coating is provided on a silicon substrate and each chip is interconnected with this metal coating using a solder. SOLUTION: In the case where an MCM...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KINGU RIEN TAI, TOOMASU DEIKUSON DEYUDARAA, ARAN MAIKERU RIONZU, INON DEGANI, BIYUNGU JIYOON HAN
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To dispense with a wire-bonding interconnection and moreover, to reduce the thickness of a package by a method, wherein a metal coating is provided on a silicon substrate and each chip is interconnected with this metal coating using a solder. SOLUTION: In the case where an MCM tile 11 is electrically and mechanically interconnected with a PW board 12, an opening 20 of such a size that chips 16 and 17 on a silicon substrate 15 are housed, without coming into contact with the wall part of the opening is provided in the board 12. The end parts only of the silicon substrate 15 provided with a peripheral metal coating 19 come into contact with a metallic printed circuit 13 on the board 12, via reflow- soldered interconnection parts 21 and the chips 16 and 17 are housed in the opening 20. Thereby, when a circuit on the substrate 15 is connected with a circuit 13 on the board 12, the necessity for a wire-bonding connection is eliminated. Moreover, the thickness of an assembled body is reduced as much as the thickness of at least the chips and the thickness of the interconnection parts between the chips and the substrate 15.