APPARATUS AND METHOD FOR SEPARATING AND CONVEYING WAFER

PURPOSE: To provide the wafer separating and conveying apparatus, which has the simple structure and can securely separate wafers one by one and can convey the wafer into the specified direction. CONSTITUTION: Many wafers 27 are supported in the laminated state in liquid 12 by a supporting member 26...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TSUBATA TEIICHI, IMAI HIROSHI, MIYATA TAKEAKI, KAWAGUCHI SHIGERU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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