APPARATUS AND METHOD FOR SEPARATING AND CONVEYING WAFER

PURPOSE: To provide the wafer separating and conveying apparatus, which has the simple structure and can securely separate wafers one by one and can convey the wafer into the specified direction. CONSTITUTION: Many wafers 27 are supported in the laminated state in liquid 12 by a supporting member 26. The many wafers 27 are lifted by the specified amount by the lifting of the supporting member 26. One wafer 27 located at the uppermost part is arranged at the position in the vicinity of a water surface 12a. Water is injected from an injecting nozzle 30 to the position deviated from the center of the upper surface of the wafer 27 at the water-surface position, and the wafer 27 is turned into one direction. The wafer 27 at the uppermost part is separated from the other wafer 27. Furthermore, water is injected from the slant upper direction at the opposite side of the conveying direction from an injecting nozzle 29, and floating of the wafer 27 at the uppermost part is prevented. The separated wafer 27 is conveyed into the output conveying direction.