METHOD AND DEVICE FOR TREATMENT
PURPOSE: To quickly remove a photoresist by supplying a treating fluid to an object to be treated set on a turntable at a position deviated from the center of rotation of the turntable while the object set on the turntable is rotated so that the fluid can be uniformly and efficiently supplied to the...
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Sprache: | eng |
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Zusammenfassung: | PURPOSE: To quickly remove a photoresist by supplying a treating fluid to an object to be treated set on a turntable at a position deviated from the center of rotation of the turntable while the object set on the turntable is rotated so that the fluid can be uniformly and efficiently supplied to the surface of the object. CONSTITUTION: A flow passage 5 having a relatively narrow width is formed between an object 3, such as the semiconductor wafer, etc., and a guide plate on a turntable 2 over the entire surface of the object 3. While a treating fluid 7 composed of a mixed gas of oxygen and ozone, etc., is supplied to the flow passage 5 through a nozzle 6 opened at a position deviated from the center of rotation of the object 3 so that the fluid 7 can flow on the entire surface of the object 3, the surface of the object 3 is irradiated with ultraviolet rays having a prescribed wavelength which falls within a specific wavelength range from a light source 8 through the guide plate 4 so that a photoresist coating the surface of the object 3 can be oxidized quickly and removed as carbon dioxide, steam, etc. The carbon oxide, steam, etc., are discharged to the outside from an exhaust port 9. |
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