REACTIVE MAGNETRON SPUTTERING DEVICE

PURPOSE: To minimize the deposition of an insulating film on an anode and to maintain a stable discharge over a long period by laminating plural conductive sheets to constitute the anode at the ground potential to have a gap and injecting an electron emitted from a target into the anode. CONSTITUTION: A vacuum vessel 11 is evacuated to a specified vacuum, and a negative voltage is impressed on a target 14 from a DC power source 12 through a packing plate 13. A glass substrate 31 is heated by a heater 30, gaseous Ar and oxygen are introduced respectively from cylinders 20 and 21 through mass controllers 22 and 23 to produce plasma, the plasma is trapped in the vicinity of the target 14 by the magnetic field of a magnet unit 15, and hence the target 14 is sputtered to form a coating film on the substrate 31. At this time, the anode 34 at the ground potential is multiplexed by laminating plural conductive sheets to have a gap, and an ionized introduced gas is injected into the anode. Consequently, the deposition of an insulating film on the anode 34 is decreased, and a stable discharge is maintained for a long period.