SEMICONDUCTOR PROCESSING EQUIPMENT THAT HOLDS SIDE OF WAFER AND TRANSFERS IT

PROBLEM TO BE SOLVED: To eliminate gas leaks between a reactor and tripod by providing a means for gripping the side face of a wafer, wafer carrier including means for detecting the malfunction thereof, and vacuum reactor having a vacuum exhaust hole at the bottom of a wafer chuck. SOLUTION: A gripp...

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Bibliographische Detailangaben
Hauptverfasser:	CHIYOU GENYOKU, CHIYOU KIKOU, SAI FUEN, RI SHIYOUHIYUN, YU KEISHIYUN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHAMBERS PROVIDED WITH MANIPULATION DEVICES CONVEYING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS HAND TOOLS HANDLING THIN OR FILAMENTARY MATERIAL MANIPULATORS PACKING PERFORMING OPERATIONS PNEUMATIC TUBE CONVEYORS PORTABLE POWER-DRIVEN TOOLS SEMICONDUCTOR DEVICES SHOP CONVEYOR SYSTEMS STORING TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To eliminate gas leaks between a reactor and tripod by providing a means for gripping the side face of a wafer, wafer carrier including means for detecting the malfunction thereof, and vacuum reactor having a vacuum exhaust hole at the bottom of a wafer chuck. SOLUTION: A gripper of a wafer carrier has a forefinger 110 for holding the side face of a wafer and wafer contacting ends at the tops of both its sides or center end support 102. A support table 100 has an optical sensor 160 for detecting the existence of the light shut-off by an operating lever 113 of the forefinger 110 at a detector of the wafer carrier, thereby detecting the malfunction at operating of the gripper. A tripod at the bottom of a wafer chuck and drive unit are removed, to allow a vacuum exhaust hole and vacuum pump to be located at the bottom of the chuck. This maintains the axial symmetry of a process gas flow which is fed from an upper gas feeder to enhance the process uniformity.