CHIP BONDER

PURPOSE: To increase the bonding speed by disposing a collet between a board and a chip bearing member, temporarily touching the collet to the chip bearing member and then separating the collet therefrom before turning the collet and bringing the collet close to the board, and then turning the collet again and setting the collet to take an attitude for touching the chip bearing member or separating therefrom thereby shortening the moving distance of the collet. CONSTITUTION: A collet 4 touches a chip bearing surface 10 or separates therefrom while facing the direction normal to the chip bearing surface 10. A chip 6 located at the pickup position of a chip bearing member 9 is picked up by a suction force acting when the collet 4 approaches the chip bearing surface 10. While acting the suction force, the chip 6 is then brought close to the bonding face 7 on the upper surface 5b of aboard or separated therefrom with an axis extending in parallel with the surface 5a of the board as a center thus bonding the chip 6 onto the bonding face 7 at the bonding position. Finally, regressive operation is carried out around the axis until the collet 4 faces the direction normal to the chip bearing surface 10.