CERAMIC BONDING DEVICE

PURPOSE: To heat the ceramic materials to be bonded in a short time and to efficiently and easily bond the materials by lighting plasma close to the bonding interfaces by the concentration of an electric field and absorbing the energy of a microwave in the plasma. CONSTITUTION: The two materials 7 to be bound at least one of which is ceramic are inserted in a microwave resonator 4 to form a slight clearance between the bonding interfaces of the materials 7. An atmospheric gas suitable to produce plasma is then supplied into the resonator 4 from the feed means 6, and a microwave is simultaneously supplied into the resonator 4 from a microwave oscillator 1 through a waveguide 2 to generate an electric field vertical to the interfaces in the clearance between the bonding interfaces of the materials 7. Plasma is lit close to the bonding interfaces, and the materials 7 are pressed by pressing control means 5 and bonded. The bonding efficiency is further improved by interposing an insert 10 having a lower softening point than the material 7 between the bonding interfaces.