CASING TYPE ELECTRONIC PART
PURPOSE: To enable the casing of a chip element of a special structure such as an electrostatic capacity element of a structure of small dielectric loss in a casing type electronic part whose chip element is cased in a case and constituted to enable automatic mounting on a circuit board. CONSTITUTIO...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PURPOSE: To enable the casing of a chip element of a special structure such as an electrostatic capacity element of a structure of small dielectric loss in a casing type electronic part whose chip element is cased in a case and constituted to enable automatic mounting on a circuit board. CONSTITUTION: A recessed part 33 is formed in a case 30 formed of liquid crystal polymer, etc. Electrode layers 34, 35 formed in one side surface 33a of the recessed part 33 are extended to both side surfaces 36, 37 and a bottom of the case 30. In a chip element 20, a first electrode 24 and a second electrode 25 are formed in one side surface thereof, the chip element 20 is contained in the recessed part 33 and the electrodes 24, 25 are soldered to the electrode layers 34, 35. If the chip element 20 is an electrostatic capacity element, a dielectric layer and the electrodes 24, 25 conductive to front and rear surfaces of the dielectric layer are arranged in a surface of a substrate 21. An element which is not affected by dielectric loss of the substrate 21 can be thereby constituted. |
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