SUBSTRATE FOR RESIN-SEALED SEMICONDUCTOR DEVICE
PURPOSE: To prevent a crack from being generated and to prevent a die for cutting from being damaged when a rectangular board is cut into individual circuit boards. CONSTITUTION: In a board for a resin-sealed semiconductor device, a plurality of circuit boards 2 on which semiconductor chip mounting...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | PURPOSE: To prevent a crack from being generated and to prevent a die for cutting from being damaged when a rectangular board is cut into individual circuit boards. CONSTITUTION: In a board for a resin-sealed semiconductor device, a plurality of circuit boards 2 on which semiconductor chip mounting parts 3 and required wiring patterns 4 have been formed are lined and formed to be rectangular. On the board, metal patterns 12 are formed in parts, on the respective circuit boards, with which air vent parts formed in a molding mold used for a resin sealing operation come into contact. |
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