METHOD FOR BONDING RESIN FILM TO METAL SURFACE

PURPOSE: To provide the method intended to properly melt esp. a hot-melt adhesive stuck on a resin film through dielectric heating with microwaves in bonding the resin film to the surface of a metal such as the outer ply of a hull. CONSTITUTION: A hot-melt adhesive 6 stuck on one side of a resin fil...

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Bibliographische Detailangaben
Hauptverfasser: ENDOU MASAMORI, OSAKI MASARU
Format: Patent
Sprache:eng
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