METHOD FOR BONDING RESIN FILM TO METAL SURFACE

PURPOSE: To provide the method intended to properly melt esp. a hot-melt adhesive stuck on a resin film through dielectric heating with microwaves in bonding the resin film to the surface of a metal such as the outer ply of a hull. CONSTITUTION: A hot-melt adhesive 6 stuck on one side of a resin fil...

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Bibliographische Detailangaben
Hauptverfasser:	ENDOU MASAMORI, OSAKI MASARU
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES EQUIPMENT FOR SHIPPING METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES RELATED EQUIPMENT SHIPS OR OTHER WATERBORNE VESSELS TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PURPOSE: To provide the method intended to properly melt esp. a hot-melt adhesive stuck on a resin film through dielectric heating with microwaves in bonding the resin film to the surface of a metal such as the outer ply of a hull. CONSTITUTION: A hot-melt adhesive 6 stuck on one side of a resin film 7 is melted by the dielectric heating with microwaves in such a way that the adhesive 6 on the resin film 7 is pressed against a metal plate 8 by using a microwave wave-guiding member 1 with such a mechanism that microwaves introduced from a microwave generator 5 via a load matching device 4 are radiated downward, thus effecting bonding the resin film 7 to the upper surface of the metal plate 8. In this case, as the microwaves are reflected on the upper surface of the metal, plate 8, the dielectric heating can be conducted efficiently.