WIRE BONDING DEVICE

PURPOSE: To perform stable wire-bonding by ensuring the fixing to an ultrasonic vibration of a capillary in an ultrasonic thermocompression bonding system of a wiring bonding device, and enable efficient conduction of ultrasonic waves even if the frequency of ultrasonic vibration is increased. CONST...

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Bibliographische Detailangaben
1. Verfasser:	SEKI ISAO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE: To perform stable wire-bonding by ensuring the fixing to an ultrasonic vibration of a capillary in an ultrasonic thermocompression bonding system of a wiring bonding device, and enable efficient conduction of ultrasonic waves even if the frequency of ultrasonic vibration is increased. CONSTITUTION: A mounting hole 8a for a capillary 11 opened downward and a screw hole 8b being open from the tip of an ultrasonic vibrator 10 and through to the mounting hole 8a are provided at the tip of the ultrasonic vibrator 10. The capillary 11 is attached, roughly vertically to the bonding face 2, in the mounting hole 8a, and it is fixed by fastening the top flank of the capillary 11 in axial direction of the ultrasonic vibrator 10 from the screw hole 8b with a set screw 15. Hereby, the capillary can be surely fixed and stuck close to the ultrasonic vibrator.