PRINTED CIRCUIT BOARD

PURPOSE: To enable the check of an interconnection circuit beneath a coating film when electromagnetic-, microwave- and magnetic field-shield coating film is formed by forming on the shield coating film face a circuit pattern for checking the interconnection circuit beneath the film. CONSTITUTION: A coating film 2 for shielding electromagnetic waves, microwaves and magnetic fields is formed on required area of a printed interconnection board, except electric connection areas such as parts lands 1 of circuits formed on the board. On the film 2 a pattern similar to a circuit 4 formed beneath the film 2 is printed with dots or cross lines, together with circuit connections, or a circuit pattern is printed with symbol characters 3. The circuit beneath the electromagnetic wave, microwave or magnetic field shielding coating film can be checked visually and easily, using the circuit pattern printed on the shielding coating film.