CURING CATALYST AND EPOXY RESIN COMPOSITION CONTAINING THE CATALYST

PURPOSE: To obtain the subject catalyst comprising a specific compound and an aluminum compound, having an excellent curing characteristic at higher temperatures than room temperature, imparting high storage stability to resin compositions at the room temperature, and useful for curing epoxy resins, etc. CONSTITUTION: This catalyst comprises (A) at least one compound selected from a group consisting of compounds of formulas I-III (A is aromatic group, heterocyclic aromatic group; R1 is 1-20C hydrocarbon group; X is O, NH; Y is O, S; K is an integer of 1-10), and (B) at least one aluminum compound (preferably an organic aluminum compound, e.g. trimethoxy aluminum). When the compound of formula A is a compound of formula: Ph-O-R' (Ph is phenyl; R' is pyranyl, etc.), the catalyst is especially excellent in thermal decomposition resistance and is advantageous on the rapid curing of resin compositions at >=a prescribed temperature which is higher than the room temperature. The component B is preferably added in an amount of 10-200 pts.wt. per 100 pts.wt. of the component A.