PAD-ON-PAD-TYPE CONTACT,CONNECTOR AND SPRING-ARRAY ASSEMBLY COMPONENT

PROBLEM TO BE SOLVED: To provide a pad-on-pad type contact for electronic devices. SOLUTION: A contact includes a spring member 10 which comprises: a support segment 11, a spring segment 12 having a part which has the same direction and the angle as the support segment 11, and a compressed segment 1...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	POORU UIRIAMU KOTEASU, ARUFUONSO FUIRITSUPU RANZETSUTA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a pad-on-pad type contact for electronic devices. SOLUTION: A contact includes a spring member 10 which comprises: a support segment 11, a spring segment 12 having a part which has the same direction and the angle as the support segment 11, and a compressed segment 13 which is almost equal in size to a pad face and substantially parallel to the pad face. By virtue of a shape and a material of the spring member 10, when contacts 14 and 15 come in contact with each other, pad surfaces 16 and 17 get into wiping with each other, and subsequently both members are secured under a permanent compressive force through a period of use.