SEMICONDUCTOR PACKAGE AND MANUFACTURE THEREOF

PURPOSE: To provide a semiconductor package which is lessened in size and thickness and enhanced in density and reliability. CONSTITUTION: Electrodes 2 are formed on the one side of a board 1 of alumina or aluminum nitride. The electrodes 2 are arranged on the periphery of the board 1. A protrudent electrode 3 of Au is on provided on reach of the electrodes 2. The electrode (pad) of a semiconductor chip 4 and the protrudent electrode 3 of the board 1 are bonded together by metal solid phase diffusion. The conditions of solid phase diffusion are so set as to restrain voids from being produced between the electrodes of the semiconductor chip 4 and the protrudent electrodes 3 of the board 1. Resin is filled between the board 1 and the semiconductor chip 4.