METHOD FOR CUTTING GLASS SUBJECTED TO FILM FORMATION TREATMENT ON ONE SURFACE
PURPOSE:To stably cut a glass substrate formed with a film on one surface without flawing its surface formed with the film. CONSTITUTION:The glass substrate 11 with its surface 11a side formed with a film positioned downward is supported and fixed onto a jig table 10 by interposing a spacer 12 only...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PURPOSE:To stably cut a glass substrate formed with a film on one surface without flawing its surface formed with the film. CONSTITUTION:The glass substrate 11 with its surface 11a side formed with a film positioned downward is supported and fixed onto a jig table 10 by interposing a spacer 12 only under the surface 11a formed with the film of the unnecessary glass part 11b of the glass substrate 11. The surface (the upper surface) which is not the surface 11a formed with the film is then scribed by a chipping blade 14 from above to form a crack 15. The glass substrate 11 is thereafter parted by applying the load in a direction where this crack 15 is grown upon the glass substrate 11. |
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