PLATING ON INSULATING BASE MATERIAL AND PLATED OBJECT OBTAINED BY THIS PLATING

PURPOSE: To form metallic films having high adhesion strength and high electrical conductivity by successively laminating a conductive film, reduced layer, catalyst layer and metallic plating film on an insulating base material. CONSTITUTION: The conductive film 2 (ITO, etc.) is formed by a vapor de...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YASHIRO MASAYUKI, SUDO MIKIO, KOBAYASHI TAKESHI, NAGOYA NOBUO, YOSHIKAWA HIROYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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