PLATING ON INSULATING BASE MATERIAL AND PLATED OBJECT OBTAINED BY THIS PLATING

PURPOSE: To form metallic films having high adhesion strength and high electrical conductivity by successively laminating a conductive film, reduced layer, catalyst layer and metallic plating film on an insulating base material. CONSTITUTION: The conductive film 2 (ITO, etc.) is formed by a vapor deposition method, etc., on one surface of the insulating base material 1 (glass, etc.) having the smooth surface and the surface layer of this conductive film is electrolytically treated in an electrolyte (lactic acid, etc.) compounded with an inhibitor, by which the reduced layer 4 and an inhibitor layer 3 are formed on the conductive film 2. The inhibitor layer 3 is then removed by an org. solvent, etc., and the catalyst layer 5 is deposited by acting a treating liquid contg. metal ions (Pd, etc.) having a catalytic effect. An etching resist is then applied thereon to form its layer 7. Further, the etching of the conductive film 2 and the peeling of the remaining resist are executed by resist imaging by exposing and developing and, thereafter, the desired parts are subjected to electroless plating of Ni, etc., by which the metallic plating films 6 are formed on the catalyst layer 5. As a result, the plated object having a high light shielding rate and low reflectivity is obtd.