METHOD AND APPARATUS FOR MANUFACTURING RESIN BOARD

PURPOSE: To form recesses with high accuracy by prolonging the tact period and enhancing the fluidity of resin without decreasing the producibility. CONSTITUTION: A resin board material 4 is situated between an embossing mold 14 with a thin film electric resistance layer 13 coated in its surface and...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KITAICHI SATOSHI, KIMOTO HIDETOSHI, NAKAMURA CHIAKI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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