METHOD AND APPARATUS FOR MANUFACTURING RESIN BOARD

PURPOSE: To form recesses with high accuracy by prolonging the tact period and enhancing the fluidity of resin without decreasing the producibility. CONSTITUTION: A resin board material 4 is situated between an embossing mold 14 with a thin film electric resistance layer 13 coated in its surface and...

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Bibliographische Detailangaben
Hauptverfasser:	KITAICHI SATOSHI, KIMOTO HIDETOSHI, NAKAMURA CHIAKI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PURPOSE: To form recesses with high accuracy by prolonging the tact period and enhancing the fluidity of resin without decreasing the producibility. CONSTITUTION: A resin board material 4 is situated between an embossing mold 14 with a thin film electric resistance layer 13 coated in its surface and a receiving mold 16 with a thin film electric resistance layer 15 coated in its surface, and then electrification is effected between the thin film electric resistance layers 13, 15, following this, recesses are formed by pressing the embossing mold 14 against the receiving mold 16.