SURFACE TREATMENT OF COPPER MEMBER

PURPOSE: To suppress the rise of natural potential and to prevent pitting corrosion by forming an oxidized coating film on a copper member by oxidation under heating in an oxygen-contg. atmosphere. CONSTITUTION: A copper member such as a copper tube is heated in an oxygen- contg. atmosphere such as...

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Bibliographische Detailangaben
Hauptverfasser:	NISHIKAWA SHOZO, HIRANO SHOEI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PURPOSE: To suppress the rise of natural potential and to prevent pitting corrosion by forming an oxidized coating film on a copper member by oxidation under heating in an oxygen-contg. atmosphere. CONSTITUTION: A copper member such as a copper tube is heated in an oxygen- contg. atmosphere such as air to form a corrosion resistant oxidized coating film of about 10-500nm thickness on the surface of the copper member. Since this oxidized coating film formed by surface treatment acts as a barrier to electronic conduction, even when an active oxygen producing field is formed, a cathode reaction is not accelerated, the rise of natural potential does not occur and pitting corrosion is prevented.