LEAD FRAME AND SEMICONDUCTOR DEVICE EMPLOYING IT

PURPOSE:To shorten the design/development schedule and to reduce the design/ development cost of semiconductor device by preventing short circuit between a bonding wire and an adjacent inner lead frame thereby allowing common use of lead frame. CONSTITUTION:A lead frame 2 for receiving a semiconductor chip 1 is subjected to etching and then the end part of inner lead 2a is potted or coated with a predetermined width of insulating material 3 of polyimide resin, for example. The semiconductor device 1 is then bonded onto the lead frame 2 and an electrode formed on the semiconductor chip 1, i.e., a bonding pad, is connected electrically with the inner lead 2a through a bonding wire 4.