ALIGNER AND MANUFACTURE OF SEMICONDUCTOR DEVICE USING SAME
PURPOSE:To obtain such an aligner for semiconductor devices that a pattern on the surface of a mask irradiated with a luminous flux from an arcuated slit-like opening is projected upon a substrate with high accuracy by means of a mirror projecting optical system. CONSTITUTION:The slit 3 of an aligne...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PURPOSE:To obtain such an aligner for semiconductor devices that a pattern on the surface of a mask irradiated with a luminous flux from an arcuated slit-like opening is projected upon a substrate with high accuracy by means of a mirror projecting optical system. CONSTITUTION:The slit 3 of an aligner is made wider at its both end sections in the scanning direction as compared with its central part so that a pattern on the entire surface of a mask 4 irradiated in a slit-like state with light from a lighting system 1 through a slit 3 can be projected upon a wafer 5 by simultaneously scanning both the mask 4 and wafer 5 against a projecting optical system by means of a driving means when the pattern on the surface of a mask 4 is projected upon the surface of the wafer 5 through the projecting optical system. |
---|