ALIGNER AND MANUFACTURE OF SEMICONDUCTOR DEVICE USING SAME

PURPOSE:To obtain such an aligner for semiconductor devices that a pattern on the surface of a mask irradiated with a luminous flux from an arcuated slit-like opening is projected upon a substrate with high accuracy by means of a mirror projecting optical system. CONSTITUTION:The slit 3 of an aligne...

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Bibliographische Detailangaben
Hauptverfasser: ISOHATA JUNJI, SHIMEKI KOUICHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To obtain such an aligner for semiconductor devices that a pattern on the surface of a mask irradiated with a luminous flux from an arcuated slit-like opening is projected upon a substrate with high accuracy by means of a mirror projecting optical system. CONSTITUTION:The slit 3 of an aligner is made wider at its both end sections in the scanning direction as compared with its central part so that a pattern on the entire surface of a mask 4 irradiated in a slit-like state with light from a lighting system 1 through a slit 3 can be projected upon a wafer 5 by simultaneously scanning both the mask 4 and wafer 5 against a projecting optical system by means of a driving means when the pattern on the surface of a mask 4 is projected upon the surface of the wafer 5 through the projecting optical system.