CREAM SOLDER FOR PREVENTING CHANGE WITH LAPSE OF TIME AND METHOD FOR PACKAGING PARTS BY USING THE SAME

PURPOSE:To prevent drying and oxidizing of the cream solder for preventing a change with lapse of time formed by enveloping cream solder with a capsule container and to lessen the generation of defective articles by printing the land surfaces of a printed circuit board with this cream solder. CONSTI...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SAKAGAMI TOSHIAKI, MAENISHI YASUHIRO, KURIBAYASHI TAKESHI, HAYATA KAZUE
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PURPOSE:To prevent drying and oxidizing of the cream solder for preventing a change with lapse of time formed by enveloping cream solder with a capsule container and to lessen the generation of defective articles by printing the land surfaces of a printed circuit board with this cream solder. CONSTITUTION:The cream solder 10 for preventing a change with lapse of time is constituted by covering the outer periphery of the cream solder 8 with the capsule-shaped container 9. The printed circuit board is printed with the solder 10 and the parts are mounted on the circuit board. The container 9 of the solder 10 is destroyed by the pressure at the time of mounting the parts or the container is destroyed by the temp. of a reflow machine, by which the cream solder 8, the parts and the printed circuit board are joined. The cream solder 8 is held covered with the container 9 when the printed circuit board is printed with the solder 10 and, therefore, the cream solder 8 is not directly exposed to the outdoor air and the drying and oxidizing thereof do not arise. A mounting deviation, etc., is, therefore, eliminated and the defective articles are decreased.