POLYIMIDE FILM ADHESIVE

PURPOSE:To provide a polyimide film adhesive containing a specific polyimide resin and a specific rubber having high molecular weight, exhibiting excellent heat-resistance, adhesion and flexibility and suitable for circuit board, etc. CONSTITUTION:This polyimide film adhesive contains (A) a polyimid...

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Bibliographische Detailangaben
1. Verfasser:	OKUNOYAMA TERU
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PURPOSE:To provide a polyimide film adhesive containing a specific polyimide resin and a specific rubber having high molecular weight, exhibiting excellent heat-resistance, adhesion and flexibility and suitable for circuit board, etc. CONSTITUTION:This polyimide film adhesive contains (A) a polyimide resin of the formula I {R is tetravalent organic acid residue; >=50mol% of the total acid component constituting the group R is biphenyl ether tetracarboxylic acid of the formula II; R is bivalent diamine residue; 50-99mol% of the total diamine component constituting the group R is diamine compound of the formula III [X is CH2, O, C(CH3)2, SO2 or C(CF3)2] and 50-1mol% is diaminosiloxane of the formula IV (R'' and R' are bivalent organic group; R to R are 1-6C hydrocarbon group; (n) is 0-12)} and (B) preferably 5-40wt.% (based on the component A) of a high-molecular weight rubber having a weight-average molecular weight of >=10,000.