SEMICONDUCTOR SUBSTRATE LAMINATING DEVICE

PURPOSE:To provide a semiconductor substrate laminating device capable of laminating even substrates having a large warpage or even substrates which have difficulty in holding because of a projection like warp, easily and stably without containing bubbles in a gap between the substrates. CONSTITUTION:A semiconductor substrate laminating device has a substrate positioning means 6 for deciding the positions of the laminating surfaces of at least a pair of substrates 7 and 8 to be laminated, substrate holding means 5 and 2, which make a gap between the substrates 7 and 8 in such a way that the laminating surfaces do not come into contact to each other to enable the substrates to face each other and hold at least a pair of the substrates 7 and 8, a pressing means 1, which applies a pressure to the pair of the substrates 7 and 8 in order from the end parts of the substrates 7 and 8 and laminates the substrates, and intersubstrate gap control means 4 and 9, which interlock to the substrate pressing position of the means 1 and hold a gap between substrate parts which are not pressed.