PROBING DEVICE

PURPOSE:To increase the mounting quantity of the circuits of various electronic parts to be mounted on a relaying board of a probing device, without any alteration of the size of the relaying board. CONSTITUTION:In a probing device 1, a test head 10 having measuring circuits for inspecting the elect...

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1. Verfasser:	UENISHI TAKAO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
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creator	UENISHI TAKAO
description	PURPOSE:To increase the mounting quantity of the circuits of various electronic parts to be mounted on a relaying board of a probing device, without any alteration of the size of the relaying board. CONSTITUTION:In a probing device 1, a test head 10 having measuring circuits for inspecting the electric characteristics of various circuits, a probe card 40 having probing needles 41 contacted with the electrode pads present on a wafer W, and a linear mother board 20 for connecting electrically the test head 10 with the probe needles 41 are provided respectively. In the probing device 1, no substantial opening hole is provided in the linear mother board 20. Thereby, the mounting area on the board is increased by the section wherein any opening hole is not present, and the quantity of the circuits of various electronic parts to be mounted on the board can be increased.
format	Patent
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CONSTITUTION:In a probing device 1, a test head 10 having measuring circuits for inspecting the electric characteristics of various circuits, a probe card 40 having probing needles 41 contacted with the electrode pads present on a wafer W, and a linear mother board 20 for connecting electrically the test head 10 with the probe needles 41 are provided respectively. In the probing device 1, no substantial opening hole is provided in the linear mother board 20. Thereby, the mounting area on the board is increased by the section wherein any opening hole is not present, and the quantity of the circuits of various electronic parts to be mounted on the board can be increased.</description><edition>6</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>1995</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19950303&DB=EPODOC&CC=JP&NR=H0758168A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19950303&DB=EPODOC&CC=JP&NR=H0758168A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>UENISHI TAKAO</creatorcontrib><title>PROBING DEVICE</title><description>PURPOSE:To increase the mounting quantity of the circuits of various electronic parts to be mounted on a relaying board of a probing device, without any alteration of the size of the relaying board. CONSTITUTION:In a probing device 1, a test head 10 having measuring circuits for inspecting the electric characteristics of various circuits, a probe card 40 having probing needles 41 contacted with the electrode pads present on a wafer W, and a linear mother board 20 for connecting electrically the test head 10 with the probe needles 41 are provided respectively. In the probing device 1, no substantial opening hole is provided in the linear mother board 20. Thereby, the mounting area on the board is increased by the section wherein any opening hole is not present, and the quantity of the circuits of various electronic parts to be mounted on the board can be increased.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1995</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOALCPJ38vRzV3BxDfN0duVhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfFeAR4G5qYWhmYWjsZEKAEAkYEcvA</recordid><startdate>19950303</startdate><enddate>19950303</enddate><creator>UENISHI TAKAO</creator><scope>EVB</scope></search><sort><creationdate>19950303</creationdate><title>PROBING DEVICE</title><author>UENISHI TAKAO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH0758168A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1995</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>UENISHI TAKAO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>UENISHI TAKAO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PROBING DEVICE</title><date>1995-03-03</date><risdate>1995</risdate><abstract>PURPOSE:To increase the mounting quantity of the circuits of various electronic parts to be mounted on a relaying board of a probing device, without any alteration of the size of the relaying board. CONSTITUTION:In a probing device 1, a test head 10 having measuring circuits for inspecting the electric characteristics of various circuits, a probe card 40 having probing needles 41 contacted with the electrode pads present on a wafer W, and a linear mother board 20 for connecting electrically the test head 10 with the probe needles 41 are provided respectively. In the probing device 1, no substantial opening hole is provided in the linear mother board 20. Thereby, the mounting area on the board is increased by the section wherein any opening hole is not present, and the quantity of the circuits of various electronic parts to be mounted on the board can be increased.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record>
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subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
title	PROBING DEVICE
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