PROBING DEVICE

PURPOSE:To increase the mounting quantity of the circuits of various electronic parts to be mounted on a relaying board of a probing device, without any alteration of the size of the relaying board. CONSTITUTION:In a probing device 1, a test head 10 having measuring circuits for inspecting the elect...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	UENISHI TAKAO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE:To increase the mounting quantity of the circuits of various electronic parts to be mounted on a relaying board of a probing device, without any alteration of the size of the relaying board. CONSTITUTION:In a probing device 1, a test head 10 having measuring circuits for inspecting the electric characteristics of various circuits, a probe card 40 having probing needles 41 contacted with the electrode pads present on a wafer W, and a linear mother board 20 for connecting electrically the test head 10 with the probe needles 41 are provided respectively. In the probing device 1, no substantial opening hole is provided in the linear mother board 20. Thereby, the mounting area on the board is increased by the section wherein any opening hole is not present, and the quantity of the circuits of various electronic parts to be mounted on the board can be increased.