REINFORCING METHOD FOR INORGANIC SUBSTRATE AND PRODUCT THEREOF

PURPOSE:To reduce a labor for an impregnating and deaerating process by a method wherein an unsaturated polyester resin composition containing a spherical hollow filler and a thixotropy producer and a fiber reinforcement are sprayed to one surface of an inorganic substrate and cured. CONSTITUTION:A...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MIZUKAMI TETSUO, KAWABATA YOSHICHIKA, TOMOKUNI HIDEHIKO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To reduce a labor for an impregnating and deaerating process by a method wherein an unsaturated polyester resin composition containing a spherical hollow filler and a thixotropy producer and a fiber reinforcement are sprayed to one surface of an inorganic substrate and cured. CONSTITUTION:A composition containing an unsaturated polyester resin and/or a vinyl ester resin containing a spherical hollow filler and a thixotropy producer is sprayed to one surface of an inorganic substrate together with a fiber reinforcement and cured. A rigidity is required for the inorganic substrate. The thickness of the inorganic substrate is the order of 0.01-30mm. As a material for the inorganic substrate, a glass, a natural stone material, a ceramic, a metal, and others are preferably used. The shape of a thixotropy imparting agent is not perticularly limited, but such a shape as a star, needle, whisker, or scale form imparting thixotropic properties to the thermosetting resin can be adopted.