COOLING BODY FOR EVENLY PRESSING CIRCUIT BOARD

PURPOSE:To obtain an efficient cooling body by a method wherein the cooling body is separated into cooling chambers through which coolant is able to flow, and the cooling chambers are expanded to uniformly press a circuit board. CONSTITUTION:A cooling body 1 is formed of flexible film and separated...

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Bibliographische Detailangaben
1. Verfasser: HIROSE SEIICHI
Format: Patent
Sprache:eng
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Zusammenfassung:PURPOSE:To obtain an efficient cooling body by a method wherein the cooling body is separated into cooling chambers through which coolant is able to flow, and the cooling chambers are expanded to uniformly press a circuit board. CONSTITUTION:A cooling body 1 is formed of flexible film and separated into cooling chambers 1C to 1F, and coolant is made to circulate in the cooling chambers 1C to 1F. When the cooling body 1 is expanded, a pressure applied to each of the cooling chambers 1C to 1F is made smaller than that applied to a single cooling chamber, and the application points of pressure to the cooling body 1 are dispersed. Therefore, the pressing force of the cooling body 1 applied onto electronic parts 4A is dispersed, so that the electronic parts 4A are less deformed and damaged, and a circuit board 4 is less warped, and consequently the cooling body 1 and the electronic part 4A are increased in contact area between them, whereby the cooling efficiency can be enhanced.