CHIP PUSHER OF DIE BONDING DEVICE

PURPOSE:To pick up a semiconductor chip without giving any damage to the chip by measuring the load acting on the chip when the chip is pushed up with a pin and controlling the operating state of the pin based on measured values. CONSTITUTION:A controller 24 raises a pin 28 through a pin supporting body and the pin 28 pushes up a semiconductor chip 11 after passing through an adhesive sheet 12. When the chip 11 is pushed, a load probe 21 and load measuring instrument 22 measure the load on the pin. When the measured value of the load becomes larger than an allowable value, the controller 24 actuates a hot-air blowing device 20 to blow hot air so as to reduce the adhesive force between the chip 11 and the sheet 12 after lowering the pin 28 to the original position. As a result, the chip 11 is separated from the sheet 12 and the damage to the chip by the pin 28 can be prevented at the time of picking up the chip 11 with a collet 13.