SURFACE FLATTENING

PURPOSE:To flatten the surface of an insulating film or the like with no application of excessive force on a flattened article and with no attaching of grinding grains further with no additional processes such as application of a resist film and patterning. CONSTITUTION:A laser transmitting member 2...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TSUKADAI KOUJI, SHIMIZU KANAE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	PURPOSE:To flatten the surface of an insulating film or the like with no application of excessive force on a flattened article and with no attaching of grinding grains further with no additional processes such as application of a resist film and patterning. CONSTITUTION:A laser transmitting member 2 is placed on the flattened surface 1 and laser light is made to be incident on the laser transmitting member 2 so as to perform total reflection on the surface to contact with the flattened surface 1 of the laser transmitting member 2 in order to constitute so that the flattened surface 1 is flattened by an evanescent wave oozing out from the surface coming in contact with the flattened surface 1 of the laser transmitting member 2.