ATTACHMENT STRUCTURE FOR EARPHONE JACK

PURPOSE:To improve positioning freedom an earphone jack and to eliminate the restrictions of the circuit constitution and the construction of a case by connecting a substrate where the earphone jack is fixed to a circuit substrate via a flexible wiring substrate. CONSTITUTION:An earphone jack 4 is f...

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Bibliographische Detailangaben
Hauptverfasser:	KUWAYAMA TATSUO, SATO TAKESHI, TAKAHASHI RYUICHI, OKAWA TATSUYA, SEKINE ISAMU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TELEPHONIC COMMUNICATION
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Beschreibung
Zusammenfassung:	PURPOSE:To improve positioning freedom an earphone jack and to eliminate the restrictions of the circuit constitution and the construction of a case by connecting a substrate where the earphone jack is fixed to a circuit substrate via a flexible wiring substrate. CONSTITUTION:An earphone jack 4 is fixed onto an earphone jack substrate 7 and also electrically connected to a logic substrate 5 via a flexible wiring substrate 8. At the same time, the substrate 7 is mechanically connected to the substrate 5 via the substrate 8. The jack 4 is led out through a small space between the substrate 5 and a front case 1 and attached into a space between a transmission/reception circuit 6 and a rear case. Furthermore it is needless to say that the part where the substrate 5 of the substrate 8 is connected to the substrate 7 can be formed in an L-shape, etc., according to the leading position of the jack 4.