MANUFACTURE OF MULTILAYERED CIRCUIT BOARD PROVIDED WITH ELECTRONIC PART MOUNTING RECESS

PURPOSE:To enhance a multilayered circuit board manufacturing process in operating efficiency by a method wherein banks are mounted on the center of a lower circuit board, and a prepreg shielding board possessed of holes into which the banks are inserted and an upper circuit board which is fitted onto the outer edge walls of the banks are placed on the lower circuit board inserting the banks of the lower circuit board into the holes provided to the prepreg shielding board, the assembly of them is thermocompressed into a laminate of integral structure, and then the banks are removed. CONSTITUTION:mXn holes into which the outer edge walls of mXn banks 2mn are inserted respectively are previously bored in a prepreg sheet 3mn, mXn holes into which the outer edge walls of mXn banks are fitted respectively are previously bored in an upper circuit board 4mn, and the prepreg sheet 3nm and the upper circuit board 4mn are placed and laminated on a multi-cavity molded lower circuit board 1mn on which banks 2mn are formed in close contact with it, inserting the banks 2mn of the lower circuit board1mn into the holes provided to the prepreg sheet 3 and moreover fitting the banks 2mn into the holes provided to the upper circuit board 4mn. The laminated body concerned is thermocompressed, and the banks 2mn are removed by swelling them with solvent, whereby spaces of prescribed shape are produced at spots where the banks 2mn were present and made to serve as recesses.