MANUFACTURE OF CONDUCTOR PATTERN OF PRINTED WIRING BOARD

PURPOSE:To provide a manufacturing method of a printed wiring board having low contact resistance of a seat pattern and stabilized quality. CONSTITUTION:The conductor pattern of a printed wiring board is manufactured by the following processes. The first process in which copper is plated, polished a...

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Bibliographische Detailangaben
Hauptverfasser:	KAMO YOSHINAO, HIROSE SEIICHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PURPOSE:To provide a manufacturing method of a printed wiring board having low contact resistance of a seat pattern and stabilized quality. CONSTITUTION:The conductor pattern of a printed wiring board is manufactured by the following processes. The first process in which copper is plated, polished and a dry film is adhered after a copper-clad laminated plate 10 has been buffed. The second process in which the dry film is stripped and etching treatment is conducted after solder plating operation has been conducted. The third process in which the above-mentioned material is polished and solder resist is formed after solder has been stripped. The fourth process in which a seat pattern 1A is electroless-plated. After all polishing processes have been finished, a seat pattern is electroless-plated. As a result, no streak is formed on the seat pattern, a smooth plated surface is formed, the contact resistance of the seat pattern can be decreased, and irregularity can also be lessened.