ELECTRODE FORMING METHOD

PURPOSE:To reduce the number of process steps and to decrease the time of each process by coating a metallic film comprising plural required layers to the entire face of a ceramic dielectric block and removing partially an undesired part through sand-blast processing. CONSTITUTION:A chemical copper...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	WATANABE GENICHI, MIYAUCHI EISAKU, TASHIRO KOJI, YAMAMOTO HIROMI, SUDO JUNICHI, YOSHIDA MASAYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION WAVEGUIDES
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Beschreibung
Zusammenfassung:	PURPOSE:To reduce the number of process steps and to decrease the time of each process by coating a metallic film comprising plural required layers to the entire face of a ceramic dielectric block and removing partially an undesired part through sand-blast processing. CONSTITUTION:A chemical copper plating film with excellent conductivity is formed on an entire face of a ceramic dielectric block 2 and a tin plating film 52 is formed thereon. Then as the electrode pattern forming process, a film resist is laminated on a pattern face 2a, developed to cure the remaining resist thereby forming a resist masking 55 on a pattern forming face 2a. Then sand blast processing using powder beam is conducted to remove the plating film 52 of the part not covered by the resist 55 thereby exposing the surface of the ceramic dielectric block 2 partially. Then the covered resist 55 is exfoliated, the block 2 is rinsed and dried to obtain the dielectric filter having a desired electrode pattern.