METHOD OF FORMING MICROMECHANISM STRUCTURE

PURPOSE: To provide a method for manufacturing a micromechanism structure body regardless of the manufacturing process of a semiconductor configuration element and applying no additional boundary conditions to the manufacturing process of the semiconductor configuration element. CONSTITUTION: For a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FURANTSU RERUMAA, HANSUUPEETAA TORAA, ANDOREA SHIRUPU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT MEASURING MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK PHYSICS SEMICONDUCTOR DEVICES TESTING
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