METHOD OF FORMING MICROMECHANISM STRUCTURE

PURPOSE: To provide a method for manufacturing a micromechanism structure body regardless of the manufacturing process of a semiconductor configuration element and applying no additional boundary conditions to the manufacturing process of the semiconductor configuration element. CONSTITUTION: For a semiconductor configuration element 10 where a process treatment is completed, a process step used in a process step used for manufacturing a semiconductor configuration element is used. However, in this case, a micromechanism structure body 34 is deposited later regardless of an original semiconductor configuration element manufacturing process.