METHOD OF FORMING INTERCONNECTION AND SEMICONDUCTOR DEVICE

PURPOSE:To form interconnections for a semiconductor device in such a manner that steps do not appear between the insulator and interconnections at the device surface. CONSTITUTION:A part of a conductive layer (tungsten layer) 2 is brought into a high resistance state by modifying it into a tungsten...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NAGASAWA HIDEJI, SHUDO SHOJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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