POLYAMIDE COMPOSITION

PURPOSE:To provide the composition prevented from depositing metallic copper during melt molding and improved in moldability by adding a small amount of a specified N-substituted thiourea compound to a polyamide composition containing a copper compound as a heat stabilizer. CONSTITUTION:The composit...

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Bibliographische Detailangaben
Hauptverfasser:	KUBO KUNIAKI, MURAI KEISUKE, KIRIYAMA SHUNICHI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PURPOSE:To provide the composition prevented from depositing metallic copper during melt molding and improved in moldability by adding a small amount of a specified N-substituted thiourea compound to a polyamide composition containing a copper compound as a heat stabilizer. CONSTITUTION:The composition comprises a polyamide, a copper compound and 0.001 to below 0.01wt.%, based on the polyamide, N-substituted thiourea compound represented by the formula (wherein R to R are each hydrogen, lower alkyl or phenyl; and R and R may be combined with each other to form a ring, provided that at least one of R to R is not hydrogen). Examples of the compounds of the formula include N-methylthiourea, N-ethylthiourea, N-phenylthiourea and N,N'-dimethylthiourea.