EQUIPMENT AND METHOD FOR EVENNESS OF WAFER SURFACE

PURPOSE: To provide an apparatus and method of planarizing a wafer surface, without using the mechanical polishing. CONSTITUTION: A fluid insulation material is applied to treating surfaces of wafers 24-31, the wafers are laid on the inner side faces of a tubular wall of a planarizer 10 with their t...

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Bibliographische Detailangaben
1. Verfasser:	HAWAADO ERU TEIGERAA
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	PURPOSE: To provide an apparatus and method of planarizing a wafer surface, without using the mechanical polishing. CONSTITUTION: A fluid insulation material is applied to treating surfaces of wafers 24-31, the wafers are laid on the inner side faces of a tubular wall of a planarizer 10 with their treating surfaces facing the center axis of the planarizer, the planarizer is rotated to exert a centrifugal force on the treating surfaces to uniformly distribute the insulation material over the wafer surfaces.