HEAT-RESISTANT INSULATING PHENOLIC MOLDING MATERIAL

PURPOSE:To provide the material having high heat resistance and excellent insulating properties and excellent in strength, thermal conductivity and flame retardancy. CONSTITUTION:100 pts.wt. powdery phenolic resin is mixed with 30-170 pts.wt. glass fibers and 30-170 pts.wt. unburnt kaolin, the total...

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Hauptverfasser:	HIRAI YOSHIAKI, KUBOTA YOSHIAKI, NAGURA SATORU
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PURPOSE:To provide the material having high heat resistance and excellent insulating properties and excellent in strength, thermal conductivity and flame retardancy. CONSTITUTION:100 pts.wt. powdery phenolic resin is mixed with 30-170 pts.wt. glass fibers and 30-170 pts.wt. unburnt kaolin, the total of the glass fibers and the unburnt kaolin being at most 200 pts.wt. The powdery phenolic resin consists of spherical primary particles of 0.1-150mum in diameter and secondary agglomerates thereof and has 0.05 to 0.15 methylol group for one phenol nucleus.