WAFER POLISHING DEVICE AND HEAD OF IT

PURPOSE:To provide a wafer polishing head which can decrease the burden of a head supporting arm, reduce vibrations and flutters of a head housing, and perform a precision specular polishing. CONSTITUTION:The top of the shank 47 of a wafer polishing head 40 is coupled with a vertical drive mechanism...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAKEDA KEISUKE, SHIRAI KEIICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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