WAFER POLISHING DEVICE AND HEAD OF IT

PURPOSE:To provide a wafer polishing head which can decrease the burden of a head supporting arm, reduce vibrations and flutters of a head housing, and perform a precision specular polishing. CONSTITUTION:The top of the shank 47 of a wafer polishing head 40 is coupled with a vertical drive mechanism...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TAKEDA KEISUKE, SHIRAI KEIICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PURPOSE:To provide a wafer polishing head which can decrease the burden of a head supporting arm, reduce vibrations and flutters of a head housing, and perform a precision specular polishing. CONSTITUTION:The top of the shank 47 of a wafer polishing head 40 is coupled with a vertical drive mechanism 46 for head consisting of an air cylinder installed in the head supporting part 42b of a head supporting arm 42, a link mechanism 45b, etc., and this vertical drive mechanism for head is operated to allow the head shank 47 make a vertical motion for a certain small distance. A stopper member 47a is installed rigidly to the top of the head shank 47 and is detained with the head supporting part 42b by disengaging a clutch furnished between the link mechanism 45b and head shank 47, and thereby the weights of the wafer polishing head 40 and a weight 62 are borne by the head supporting part 42b through the stopper member 47a.