WAFER POLISHING METHOD AND DEVICE

PURPOSE:To provide a wafer polishing method and a device for it, with which the quality of a wafer can be enhanced by performing the polishing operations in accordance with the circuit pattern which the device is embodied in a small construction. CONSTITUTION:The surface of a wafer 3 to be polished...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TAKEDA KEISUKE, SHIRAI KEIICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PURPOSE:To provide a wafer polishing method and a device for it, with which the quality of a wafer can be enhanced by performing the polishing operations in accordance with the circuit pattern which the device is embodied in a small construction. CONSTITUTION:The surface of a wafer 3 to be polished is put in pressure contact with the polishing surface 4a of a polishing machine 4 which is revolved horizontally in such a condition that a polish is interposed, and the wafer 3 is moved horizontally with a scope adjusted selectively in excess of the revolutional center C of the polishing surface 4a, and thereby the polishing surface 4a is made smaller in the diameter so that the polishing device 10 is embodied in a small construction, and the opimum sliding direction, speed, etc., of the polishing surface 4a relative to the wafer 3 are selected.