CERAMIC PRINTED WIRING BOARD WITH RESISTOR AND ITS MANUFACTURE

CERAMIC PRINTED WIRING BOARD WITH RESISTOR AND ITS MANUFACTURE

PURPOSE:To provide a ceramic printed wiring board with a resistor which is a printed wiring board provided with a thick film resistor layer, a conductor circuit layer and a connection terminal layer connecting them on a ceramic substrate and whose connection terminal is hardly corroded by solder wit...

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Hauptverfasser: KANETANI DAISUKE, IKETANI SHINICHI, MORIOKA KAZUNOBU
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
RESISTORS
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creator KANETANI DAISUKE
IKETANI SHINICHI
MORIOKA KAZUNOBU
description PURPOSE:To provide a ceramic printed wiring board with a resistor which is a printed wiring board provided with a thick film resistor layer, a conductor circuit layer and a connection terminal layer connecting them on a ceramic substrate and whose connection terminal is hardly corroded by solder without raising electric resistance of the connection terminal layer itself, and a manufacturing method thereof. CONSTITUTION:In a ceramic printed wiring board with a resistor provided with a thick film resistor layer 3, a conductor circuit layer 9, a glass layer 4 and a connection terminal layer 2 on a ceramic substrate 1, a 0.5 to 2.0mum- thick protection layer 8 wherein paste mainly consisting of a metallic element containing organic compound whose metallic element is palladium or platinum is burned on a surface of the connection terminal layer 2 is formed. In the title manufacturing method of a printed wiring board, the paste mainly consisting of the metallic element containing organic compound is burned in air at 600 to 900 deg.C and the protection layer 8 is formed.
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CONSTITUTION:In a ceramic printed wiring board with a resistor provided with a thick film resistor layer 3, a conductor circuit layer 9, a glass layer 4 and a connection terminal layer 2 on a ceramic substrate 1, a 0.5 to 2.0mum- thick protection layer 8 wherein paste mainly consisting of a metallic element containing organic compound whose metallic element is palladium or platinum is burned on a surface of the connection terminal layer 2 is formed. 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CONSTITUTION:In a ceramic printed wiring board with a resistor provided with a thick film resistor layer 3, a conductor circuit layer 9, a glass layer 4 and a connection terminal layer 2 on a ceramic substrate 1, a 0.5 to 2.0mum- thick protection layer 8 wherein paste mainly consisting of a metallic element containing organic compound whose metallic element is palladium or platinum is burned on a surface of the connection terminal layer 2 is formed. 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CONSTITUTION:In a ceramic printed wiring board with a resistor provided with a thick film resistor layer 3, a conductor circuit layer 9, a glass layer 4 and a connection terminal layer 2 on a ceramic substrate 1, a 0.5 to 2.0mum- thick protection layer 8 wherein paste mainly consisting of a metallic element containing organic compound whose metallic element is palladium or platinum is burned on a surface of the connection terminal layer 2 is formed. In the title manufacturing method of a printed wiring board, the paste mainly consisting of the metallic element containing organic compound is burned in air at 600 to 900 deg.C and the protection layer 8 is formed.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
RESISTORS
title CERAMIC PRINTED WIRING BOARD WITH RESISTOR AND ITS MANUFACTURE
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