CERAMIC PRINTED WIRING BOARD WITH RESISTOR AND ITS MANUFACTURE

PURPOSE:To provide a ceramic printed wiring board with a resistor which is a printed wiring board provided with a thick film resistor layer, a conductor circuit layer and a connection terminal layer connecting them on a ceramic substrate and whose connection terminal is hardly corroded by solder wit...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KANETANI DAISUKE, IKETANI SHINICHI, MORIOKA KAZUNOBU
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To provide a ceramic printed wiring board with a resistor which is a printed wiring board provided with a thick film resistor layer, a conductor circuit layer and a connection terminal layer connecting them on a ceramic substrate and whose connection terminal is hardly corroded by solder without raising electric resistance of the connection terminal layer itself, and a manufacturing method thereof. CONSTITUTION:In a ceramic printed wiring board with a resistor provided with a thick film resistor layer 3, a conductor circuit layer 9, a glass layer 4 and a connection terminal layer 2 on a ceramic substrate 1, a 0.5 to 2.0mum- thick protection layer 8 wherein paste mainly consisting of a metallic element containing organic compound whose metallic element is palladium or platinum is burned on a surface of the connection terminal layer 2 is formed. In the title manufacturing method of a printed wiring board, the paste mainly consisting of the metallic element containing organic compound is burned in air at 600 to 900 deg.C and the protection layer 8 is formed.