RESIN SEALING APPARATUS AND METHOD

PURPOSE:To enhance the coefficient of utilization of a resin without sacrifying the flow of the resin. CONSTITUTION:A gas passage 11 for sending gas into a mold hermetically closed from the outside is provided to a resin sealing mold 1 and a plunger head 3 and a resin 10 is injected into a cavity 8....

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Bibliographische Detailangaben
1. Verfasser:	SAKAZAKI ATSUSHI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PURPOSE:To enhance the coefficient of utilization of a resin without sacrifying the flow of the resin. CONSTITUTION:A gas passage 11 for sending gas into a mold hermetically closed from the outside is provided to a resin sealing mold 1 and a plunger head 3 and a resin 10 is injected into a cavity 8. Other wise, the bottom surface of a runner 6 is constituted of an up and down drivable runner part lower mold and, after the resin 10 is sent into the runner 6 by the plunger head 3, the runner part lower mold is raised to inject the resin 10 sent into the runner 6 into the cavity 8.